SMT

Fabrinet offers extremely flexible SMT manufacturing services for component mounting including uBGA, CSP, Flip Chip Process and COB. State-of-the-art equipment and multiple SMT lines achieve volumes ranging from medium speed through very high speed, very high precision production.

• Component Mounting
      Passive components as small as 0100 
      Various IC Packages: BGA, mBGA, QFP, Flip Chip, COB 
      Thru-hole Components 
  
• Soldering Process 
      IR Reflow and Wave Soldering 
      RoHS Compliant Process 
      Hot-bar soldering for attaching flex circuit to PCB 
  
• Visual Inspection 
      AOI 
      X-Ray (2-D and 3-D) 
      Ionic Contamination Test 
  
• PCB Testing 
      ICT (HP 3070) 
      Flying Probe 
  
• DFM Support production.